School of Materials Science and Engineering
Wuhan University of Technology, Wuhan, Hubei, 430070, China
telephone: ++0086 18827423835,
email: l.liu@whut.edu.cn,
http://smse.whut.edu.cn/yjspy/xsdw/fjs/202105/t20210521_494029.htm
https://www.researchgate.net/profile/Li-Liu-83
PERSONAL PROFILE
An intelligent, focused and enthusiastic individual who is passionate in academics. This candidate alsohas extensive teaching, supervision, research experiences, including PI on projects, fundingapplications, experimental activities, data collection, critical analysis/evaluation and concluding. Morethan 60 peer reviewed journal papers and 3 national invention patents have been published.
ACADEMIC PROFILE
Research has centered on the development of die attachments in power electronics for over 10 years,through multidisciplinary approaches in chemistry, engineering, mechanics and simulations. Thiscandidate seeks an opportunity to collaborate this research in the related fields in your institute.
EDUCATION
10/2012 – 10/2016 PhD, UK Outstanding Scholarship, Electronics Manufacture Loughborough University, UK (Supervisor: Prof. Changqing Liu)
06/2012 – 09/2012 BEng, Distinction, Materials Science and Engineering (Electronics Package)Huazhong University of Science and Technology, China
EMPLOYMENT HISTORY
10/2020 - Present Associate Professor of Electronics Manufacture, School of MaterialsScience and Engineering, Wuhan University of Technology, China
10/2016 - 09/2020 Assistant Professor of Electronics Manufacture, School of MaterialsScience and Engineering, Wuhan University of Technology, China
01/2014 – 12/2014 Research Associate, Wolfson School of Mechanical Electrical and ManufactureEngineering, Loughborough University, UK
12/2011 – 05/2012 Visiting Research Student (Outstanding Student Exchange Project, HUST),School of Materials Science and Engineering, Loughborough University, UK
SELECTED RESEARCH FUNDINGS.
01/01/2021 – 31/12/2023: Research on a low temperature and low pressure bonding technology with high strength for dieattachments in power electronic devices, National Natural Science Foundation of China (NSFC)Ref: 6200030144, ¥300000, PI.
01/01/2024 – 31/12/2025: Large-area die attach technology for high power IGBT chips, Wuhan Knowledge InnovationSpecial Dawning Program, ¥100000, PI. (Grant approved, waiting for grant reference)
01/01/2023 – 31/12/2024: Low temperature bonding mechanism of Cu@Ag solder preform through electrometric compression, Open Funding of State Key Laboratory of Advanced Welding and Joining, Ref:AWJ-23M09, ¥50000, PI.
01/01/2019 – 31/12/2020: The interfacial reaction behaviors and crystallization mechanism between Ni-W-P amorphousmetallization and Zn-Al solder for power electronics. Hubei Provincial Natural Science1 Foundation of China, Ref: P2018CFB212, ¥50000, PI.
01/01/2018 – 31/12/2019: Preparations and behaviours of Ni-W-P ternary diffusion barriers. Open Funding of State KeyLaboratory of Materials Processing and Die & Mould Technology, Ref: P2018-018, ¥50000, PI.
TEACHING. Aligned with my research in the areas of electronic packaging materials and manufacturing processes,a number of diverse components/elements embedded in a variety of teaching and learning activitiesenable an ideal opportunity to elaborate various knowledge and experience and pass them ontoyounger generations. Through these courses, some achievements have been obtained, including hosting 1 university education research project, 3 times university teaching competition awards, 3education research papers (EI index).
Introduction to Materials (Module code: 4070016110)
Micro-joining Principle and Methods (Module code: 4070640170)
Microelectronic Manufacturing Technology (Module code: 4070658170).
Materials and Structure Design of Modern Micro Electronic Packaging (Module code: 00112032)
SELECTED PUBLICATIONS.
To date in total over 60 peer-reviewed outputs typically published in Journal of Materials ProcessingTechnology, Materials Science and Engineering A, Intermetallics, Ceramics International, MaterialsCharacterization, Journal of Alloys and Compounds and etc. Authorized 3 national invention patents.
➢Liu L., Huang W., Chen Z*. Effects of temperatures on microstructure evolution anddeformation behavior of Fe-32Ni by in-situ EBSD. Materials Science and Engineering: A. 2023,875, 6: 145097.
➢Liu L., Shi R., Zhang S., Liu W., Huang S., Chen Z*. Effects of Ag shell on electrical, thermal andmechanical properties of Cu@Ag composite solder preforms by electromagnetic compactionfor power electronics. Materials Characterization. 2023, 197: 112702.
➢Chen Z., Yang F., Liu S., Hu X., Liu C., Zhou Z., Wang Z., Robertson S., Liu L.* Creep behavior ofintermetallic compounds at elevated temperatures and its effect on fatigue life evaluation ofCu pillar bumps. Intermetallics. 2022, 144: 107526.
➢Liu L., Shi L., Peng J., Jiang B., Liu S., Liu C., Chen Z*. Interfacial reaction between Sn-Ag solderand Electroless Ni-Fe-P diffusion barriers with different internal microstructure. MaterialsResearch Bulletin. 2022, 152: 111854.
➢Chen Z., Xu G., Cao Q., Ruan M., Liu S., Pan H., Liu L.* Deformation measurement in Al thinfilms at elevated temperatures by digital image correlation with speckles prepared byfemtosecond laser. Optics & Laser Technology. 2022, 155: 108339.
➢Tuo C., Yao Z., Liu W., Liu S., Liu L.,* Chen Z.,* Huang S., Cao X. Fabrication and characteristicsof Cu@Ag composite solder preform by electromagnetic compaction for power electronics.Journal of Materials Processing Technology. 2021, 292: 117056.
➢Liu X., Liu L.,* Sun R., Li J*. Low temperature sintering of MOD assisted Ag paste for die-attachapplication. Materials Letters. 2021, 305: 130799.
➢Jiang B., Zhang Q., Shi L., Zhu C., Chen Z., Liu L.,* Shi Y. Microstructure Evolution and ShearProperty of Cu-In Transient Liquid Phase Sintering Joints. Frontiers in Materials. 2021, 8:658464. (Invitation)
Full publication list is available upon request, or available on Researchgate.
COMMITTEE MEMBER.
International Conference on Electronic Packaging Technology (ICEPT), China
–‘Advanced Manufacturing’ Committee (2023)
